Measurement of Nanograin Orientations: Application to Cu Interconnects and Nanoparticle Phase Identification
نویسندگان
چکیده
منابع مشابه
Measurement of Nanograin Orientations: Application to Cu Interconnects and Nanoparticle Phase Identification
Today, orientation maps of polycrystalline material are necessary for a better understanding of, for example, the formation of voids in the interconnects modern electronic devices. In this context, EBSD (Electron BackScattering Diffraction) has proved to be a powerful tool to measure grain orientation, but its spatial resolution is limited at the best to a diameter of about 10 nm. As new genera...
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Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section
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Fully Analytical Modeling of Cu Interconnects up to 110GHz
Copper interconnects with and without the grounded shielding on the silicon substrate are modeled from 1 to 110GHz. The fully-analytical model is composed of the cascaded lumped resistor–inductor–conductor–capacitor (RLGC) circuit elements with 20 sections, and featured physical-based, scalable, and frequency-dependent characteristics. An excellent agreement is obtained between the measured, si...
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ژورنال
عنوان ژورنال: Microscopy and Microanalysis
سال: 2011
ISSN: 1431-9276,1435-8115
DOI: 10.1017/s1431927611006349